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Reduce Gold Embrittlement Risk Before Assembly
Excess gold from component terminations can weaken solder joints. Explore how controlled gold removal and robotic hot solder dipping help protect assembly reliability in this technical paper.
Circuit Technology Center

Industry Paper

Beneath the Surface: The Rise of Intelligent X-Ray Inspection

As electronics grow more complex and mission critical, hidden defects can't be left to chance. AI-powered X-ray inspection is evolving from defect detection to proactive intelligence, improving reliability, quality, and yield.

CyberOptics Corporation

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No more cartridge exchanges
The unique Revolving Measurement Unit (RMU) houses up to 6 sensors of any type that enable continuous pull/push and shear testing up to 200 kgf. Learn more.
xyztec