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Si-Photonics Packaging Summit 2026
Join industry leaders and innovators at Si-Photonics Packaging Summit 2026, where cutting-edge advances in silicon photonics, optical integration, and next-generation communications take center stage on October 1-2, 2026
IMAPS

Industry Paper

Oxide Reduction for Reliable Power Electronics Manufacturing

As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.

Plasmatreat GmbH

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Advanced Microelectronic Packaging and Fiber Optics Technologies
As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially.
Tresky