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Sponsor
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LAPLACE® LAR 600A Saves Energy
Fast 4-8s reflow, massive energy savings, and 90 × 90 mm² precision scanning make LAPLACE® LAR 600A the ultimate choice for sustainable reflow processes.
PacTech
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| Industry Paper |
Effect of Package Warpage and Composite CTE on Failure Modes in Board-Level Thermal Cycling
This paper studies board level reliability for surface mount devices during thermal cycling, while specifying failure modes and locations. Failure modes are characterized using thermal warpage and surface strain data.
Akrometrix, LLC
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