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Are You Getting Component Tinning Right?
Component lead tinning involves more than dipping parts in solder. Learn about robotic hot solder dip processing, gold removal, solder thickness control, and process considerations.
Circuit Technology Center
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| Industry Paper |
Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation
This paper will present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Material compatibility on mixed metals, cleaning performance and bath life studies.
Kyzen Corporation
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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