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In situ hydrogen plasmas — A New Paradigm for Advanced Packaging
Hydrogen plasmas drive breakthroughs in 3D chip technology, enabling ultra-dense interconnects and faster signal speeds above 5 GHz.
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March 9, 2026

VIEWPOINT 2026: Rich DePoto, Business Development Manager, Uyemura



VIEWPOINT 2026: Rich DePoto, Business Development Manager, Uyemura
ich DePoto, Business Development Manager, Uyemura
Uyemura has invested ambitiously in advanced chemical technologies. As such, we can find ourselves with extraordinary solutions . . . in search of problems. When adaptation advances slowly, this approach can appear inefficient – at least temporarily.

Today's electrical design needs are clearly outpacing what's broadly available.

In our estimation, this represents a unique opportunity, where adoption of new technology solutions is now in "pull" mode. The prudent adoption of new technology is essential for companies to thrive, and for brands to increase in value.

As a supplier of advanced technology, I regard our responsibilities as fourfold. First, a thorough understanding of process requirements, including extensive resources for reliability testing. Second, extensive field support, including co-located engineering for newly adopted or installed technologies. Next, comprehensive analytical and failure analysis capability in place and fully functional. And fourth, Six Sigma statistical measurement capability and controls.

The core of our 5-year plan is a commitment to being the Partners of Choice for forward-thinking design engineers – particularly those that understand the merits of early adoption, and prioritize getting and keeping competitive advantage.

Rich DePoto, Business Development Manager
Uyemura
http://www.uyemura.com
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SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
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