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March 5, 2026
VIEWPOINT 2026: Dr. Nokibul Islam, Sr. Director, STATS ChipPACDriving Innovation Through Advanced Semiconductor Packaging
Advanced packaging technologies are gaining broad adoption across the industry due to their ability to deliver improved performance, lower system cost, enhanced integration, and greater supply chain flexibility. These solutions are already in high-volume production for AI, HPC, and networking applications, with growing momentum in next-generation automotive platforms. STATS ChipPAC works closely with its ecosystem partners to continuously develop and deliver advanced packaging solutions tailored to the evolving needs of multiple market segments. The year 2025 marked a period of expanded engagement with new development partners, strengthening our ability to support emerging technologies and customer requirements. As demand accelerates across AI, HPC, co-packaged optics (CPO), and automotive applications for 2026 and beyond, STATS ChipPAC is focused on delivering the right solutions at the right time. To support this growth, the company has launched multiple strategic initiatives, including: • Manufacturing footprint expansion • Enhanced R&D and advanced packaging capabilities • Workforce training and skills development • Targeted hiring of key technical talent • Deeper collaboration across the semiconductor ecosystem Through these initiatives, STATS ChipPAC remains committed to enabling next-generation semiconductor innovation and supporting customers from concept to high-volume production. Dr. Nokibul Islam, Sr. Director STATS ChipPAC https://www.statschippac.com/ |
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