semiconductor
packaging news
Sponsor
MicroCircuit-Laboratories-LLC

FSO Seam Seal Hermetic Packages with AI.
Particle free, purified environment inside the hermetic package with low temperature exposures to all feedthroughs and devices. Precision processing with assembly design assistance and prototyping all provided by MicroCircuit Laboratories.
MicroCircuit Laboratories, LLC
Pac-Tech
Viewpoint
February 20, 2026

VIEWPOINT 2026: Abdul Lateef, CEO, Plasma-Therm LLC



VIEWPOINT 2026: Abdul Lateef, CEO, Plasma-Therm LLC
Abdul Lateef, CEO, Plasma-Therm LLC
As we enter 2026, Plasma-Therm remains committed to enabling advanced semiconductor manufacturing companies and research institutions to achieve breakthroughs in efficiency, precision, and innovation.

Our systems and software continue to play a critical role in supporting our customer partners, helping advance next-generation devices and applications, including in healthcare and emerging electronics.

Looking ahead, 2026 will be defined by collaboration and applied innovation. By working closely with leading universities, research programs, and industry initiatives, we aim to accelerate technology development and transform it into practical solutions for manufacturers.

Upcoming enhancements to our Cortex® software and equipment portfolio will deliver greater control, repeatability, and process efficiency - empowering customers to push the boundaries of semiconductor manufacturing and advanced packaging.

We also see 2026 as an opportunity to strengthen thought leadership, sharing insights, best practices, and industry guidance to help partners navigate rapidly evolving technology landscapes. With a talented team, strong partnerships, and a commitment to innovation, Plasma-Therm is ready to help the industry meet complex challenges, advance research, and shape the future of semiconductor and advanced manufacturing technologies.

Abdul Lateef, CEO
Plasma-Therm LLC
http://www.plasmatherm.com
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
CyberOptics

SQ7000+TM Multi-Function for 3D AOI, SPI & CMM
The SQ7000+ with MRS® sensor technology delivers high-resolution, high-speed inspection and metrology, uniquely combining AOI, SPI, and CMM in one in-line system.
Nordson Test & Inspection
kyzen