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| Viewpoint | |
January 28, 2026
VIEWPOINT 2026: Bob Patti, Founder and CEO, NHanced Semiconductors
Diamond heat spreaders will rescue 1.X nm devices Heat concentration at nanometer scale presents new challenges. Localized hot spots must be tamed to allow maximum performance. Diamond, a technology that has been advancing for decades, appears to be in the right place at the right time to fill that need. In-package liquid cooling will ship to end customers In-package liquid cooling, a novelty for more than a decade, has been held back by concerns about the sophisticated "plumbing." However, today's leading-edge semiconductors have burst through the 1,000 W per package wall and are advancing toward several thousand watts per package. While in-package liquid cooling is not yet going mainstream, it should appear in some production devices in 2026. On other fronts, I expect to see larger interposers (including glass interposers) and the emergence of domestic research facilities such as NGMM/TIE and ASU to seed and incubate new advanced packaging technologies and architectures. Bob Patti, Founder and CEO NHanced Semiconductors https://nhanced-semi.com/ |
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