Sponsor

Proven Die-Attach Pastes and Films
Low moisture absorption proven to meet AEC Grade-0 and MSL Level-1 reliability. Wafer level applicable DAF. Up to 250° wire-bonding and rapid curable for ultimate productivity.
AI Technology, Inc.

Viewpoint

January 28, 2026

VIEWPOINT 2026: Bob Patti, Founder and CEO, NHanced Semiconductors

In 2026, advanced packaging will continue to grow. With that growth comes renewed focus on the perennial thermal problem – with more circuits stacked in smaller spaces, how can we prevent melt-down? Two solutions are emerging: diamond heat spreaders and in-package liquid cooling.

Diamond heat spreaders will rescue 1.X nm devices

Heat concentration at nanometer scale presents new challenges. Localized hot spots must be tamed to allow maximum performance. Diamond, a technology that has been advancing for decades, appears to be in the right place at the right time to fill that need.

In-package liquid cooling will ship to end customers

In-package liquid cooling, a novelty for more than a decade, has been held back by concerns about the sophisticated "plumbing." However, today's leading-edge semiconductors have burst through the 1,000 W per package wall and are advancing toward several thousand watts per package. While in-package liquid cooling is not yet going mainstream, it should appear in some production devices in 2026.

On other fronts, I expect to see larger interposers (including glass interposers) and the emergence of domestic research facilities such as NGMM/TIE and ASU to seed and incubate new advanced packaging technologies and architectures.

Bob Patti, Founder and CEO
NHanced Semiconductors
https://nhanced-semi.com/

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Convenient Desktop Plasma System
The PE-100 utilizes a capacitive parallel plate design for the most effective plasma generation available. Our systems offer uniform plasma with a low environmental impact at a great value.
Plasma Etch