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FSO Hermetic Package HDHS® Technology
Seam sealing with metal to metal seals and low temperature exposure. Inside the hermetic package the atmosphere is precisely controlled. Auer package tooling reduces handling and contamination.
MicroCircuit Laboratories, LLC
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Viewpoint
February 4, 2026

VIEWPOINT 2026: Guido Ueberreiter, VP Semiconductor Strategy, VON ARDENNE



Not Just More of the Same: Innovation at All Levels

VIEWPOINT 2026: Guido Ueberreiter, VP Semiconductor Strategy, VON ARDENNE
Guido Ueberreiter, VP Semiconductor Strategy, VON ARDENNE
Talking about semiconductors in 2025 inevitably means discussing artificial intelligence (AI)—and the geopolitical challenges shaping the industry. However, we are seeing technological progress across many aspects of the industry.

Single-digit nanometer logic technology is a fascinating segment of the semiconductor industry, pushing structures down into the single-atom scale toward fundamental physical limits. But scaling alone is not the only innovation required to keep the "brain" of the AI infrastructure busy.

The larger systems that generate data through MEMS devices, transport that data through high-speed optical links, and deliver the power required to move and process these massive data volumes are also critically important.

In 2026, many of these applications will gain even more momentum. Emerging technologies will move from R&D to production, while established technologies will become more cost-efficient.

VON ARDENNE's equipment portfolio will be used to drive innovation across materials, processes, and form factors in advanced packaging and co-packaged optical and electrical chips.

With its newly established cleanroom and decades of experience, VON ARDENNE is well-positioned in 2026 to develop new materials and help customers ramp up their production faster.

Guido Ueberreiter, VP Semiconductor Strategy
VON ARDENNE
https://vonardenne.com/
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Pac-Tech

LAPLACE® LAR 600A Saves Energy
Fast 4-8s reflow, massive energy savings, and 90 × 90 mm² precision scanning make LAPLACE® LAR 600A the ultimate choice for sustainable reflow processes.
PacTech
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