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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
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February 4, 2026

VIEWPOINT 2026: Guido Ueberreiter, VP Semiconductor Strategy, VON ARDENNE



Not Just More of the Same: Innovation at All Levels

VIEWPOINT 2026: Guido Ueberreiter, VP Semiconductor Strategy, VON ARDENNE
Guido Ueberreiter, VP Semiconductor Strategy, VON ARDENNE
Talking about semiconductors in 2025 inevitably means discussing artificial intelligence (AI)—and the geopolitical challenges shaping the industry. However, we are seeing technological progress across many aspects of the industry.

Single-digit nanometer logic technology is a fascinating segment of the semiconductor industry, pushing structures down into the single-atom scale toward fundamental physical limits. But scaling alone is not the only innovation required to keep the "brain" of the AI infrastructure busy.

The larger systems that generate data through MEMS devices, transport that data through high-speed optical links, and deliver the power required to move and process these massive data volumes are also critically important.

In 2026, many of these applications will gain even more momentum. Emerging technologies will move from R&D to production, while established technologies will become more cost-efficient.

VON ARDENNE's equipment portfolio will be used to drive innovation across materials, processes, and form factors in advanced packaging and co-packaged optical and electrical chips.

With its newly established cleanroom and decades of experience, VON ARDENNE is well-positioned in 2026 to develop new materials and help customers ramp up their production faster.

Guido Ueberreiter, VP Semiconductor Strategy
VON ARDENNE
https://vonardenne.com/
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Current Characterization of Various Cu RDL Designs In WLP
This study evaluates copper redistribution layer fusing currents in WLP through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance.
Amkor Technology
Henkel-AG-Co