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Die-Module Attach for High Power Devices
High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding.
AI Technology, Inc.

Viewpoint

February 3, 2026

VIEWPOINT 2026: Doug Dixon, CEO, 360 BC Group Inc.

Elevating Technical Storytelling for the Semiconductor Packaging Revolution

Doug Dixon, CEO, 360 BC Group Inc.

For 2026, we see semiconductor packaging entering its most transformative phase yet, driven by unprecedented demands from AI, high-density power electronics, heterogeneous integration, and the shift toward ultra-high-performance system architectures.

As a technical marketing and content development partner for companies across the advanced packaging ecosystem, 360 is expanding its capabilities to support this momentum.

In the coming year, we're launching new visualization and communication platforms that help engineering teams tell deeper technical stories, interactive 3D models, advanced packaging animations, hybrid-bonding education modules, and data-driven white papers grounded in real lab results.

With more companies turning to AI-assisted workflows, we're integrating machine-learning tools into our writing, graphics, and analysis pipelines to shorten development cycles and amplify accuracy.

Our focus for 2026 is helping our clients communicate differentiation clearly, accelerate product adoption, and strengthen their presence in semiconductor, power electronics, advanced substrates, and materials innovation.

360 enters 2026 with strong growth, a broadened client base, and an expanding role in shaping how the semiconductor industry communicates its most important breakthroughs.

Doug Dixon, CEO
360 BC Group Inc.
http://www.360circuits.com

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IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group