semiconductor
packaging news
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
Akrometrix
Viewpoint
February 2, 2026

VIEWPOINT 2026: Greg DeLarge, President, Plasma Etch, Inc.



VIEWPOINT 2026: Greg DeLarge, President, Plasma Etch, Inc.
Greg DeLarge, President, Plasma Etch, Inc.
As we conclude another strong year, we are proud of the progress and innovation enjoyed by our organization and our customers.

The performance and reliability of our plasma systems continue to be demonstrated across a wide range of applications from the circuit board industry to aerospace. We remain dedicated to customer success by helping clients maximize the effectiveness of their plasma cleaning systems through training, service, and support.

Looking toward 2026, we are eager to expand our impact in the bonding and PCB etching markets, not to mention some of the exciting advances our AI customer are making in high performance hardware.

Trade Shows
We are excited to participate in several industry events throughout the year and welcome the opportunity to connect in person. You can find us exhibiting at SEMICON West, October 13–15 in San Francisco, and CAMX, September 21-24 in Atlanta, GA. At both events, we will showcase our popular Plasma Wand® entry-level atmospheric plasma system.

We appreciate the continued trust of our customers and partners and look forward to another productive and successful year!

Greg DeLarge, President
Plasma Etch, Inc.
http://www.plasmaetch.com
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Master-Bond

Thermally Conductive, Low Outgassing Epoxy
Master Bond EP4UF-80 is a thermally conductive, electrically insulating adhesive that offers high mechanical strength and is used for underfill applications.
Master Bond
Amkor-Technology