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| Viewpoint | ||
January 27, 2026
VIEWPOINT 2026: Dr. Robert Wanninger, Senior Vice President Advanced Backend Solutions, SUSSAI a Growth Engine – for the Global Economy, the Semiconductor Ecosystem and SUSS
Modern AI systems rely on tightly interconnected & densely integrated packages – large AI modules that combine high-performance logic dies with stacks of high-bandwidth memory (HBM) via 2.5D & 3D packaging. We at SUSS provide the manufacturing solutions behind this, setting new standards with our bonders, coaters, imaging and, going forward, wafer-cleaning solutions. Our UV-Scanner, used at the #1 foundry for stitchless, high throughput & high yield exposure, and our temporary bonding solutions, adopted by two out of three IDMs in HBM production, are just two examples. Looking ahead, the AI ecosystem will continue to evolve rapidly – with SUSS as a key contributor. In 2025, we added high-precision hybrid bonder solutions to our portfolio ideal for 3D logic & memory stacking. In parallel, we began developing a panel UV Scanner, launching in 2026 to support AI-module production on panels. AI is reshaping the global economy, driving the semiconductor market toward the one-trillion-dollar market and setting new standards for advanced packaging. SUSS is at the heart of this development, turning AI roadmaps into robust manufacturing solutions. Dr. Robert Wanninger, Senior Vice President Advanced Backend Solutions SUSS http://www.suss.com |
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