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Viewpoint

January 19, 2026

VIEWPOINT 2026: Eelco Bergman, Chief Business Officer, Saras Micro Devices

Solving the Power Bottleneck and The Future of Advanced Compute

Eelco Bergman, Chief Business Officer, Saras Micro Devices

As we move into 2026, the demand for high-performance compute devices, especially for AI data centers, remains robust; however, the benefit of these devices on system performance is increasingly constrained by power delivery rather than transistor capability.

Yole reported that the total addressable market (TAM) for data centers reached $209 billion in 2024, spanning compute, memory, networking, and power. By 2030, that figure is projected to grow to nearly $500 billion.

AI and HPC are now the dominant market drivers, with generative AI alone reshaping demand across processors and accelerators. Increasingly powerful processors and accelerators fabricated on next-generation nodes, higher levels of silicon integration, and the rapid adoption of heterogeneous packaging are escalating power requirements and exceeding what current architectures can support.

With devices migrating to 2.5D and 3D configurations, both total power and localized power density are rising sharply. More computing activity is concentrated in smaller regions, while current paths grow longer and more demanding. As a result, loss mechanisms that were once absorbed in design margins now meaningfully impact transient response, thermal load, and long-term reliability.

These technical pressures collide with infrastructure realities, as AI processors approach multi-kilowatt power levels and system racks trend toward megawatt power consumption. As a result, data-center operators face hard limits on adding power capacity, and power budgets have become a defining boundary for deploying and activating large-scale compute.
The industry must shift from incremental solutions to fundamental architectural change.

Device-package co-optimization, vertical power-delivery paths, higher-density and performance embedded passives, and improved power-ground structures are becoming essential tools.

In 2026 and beyond, power delivery will remain a primary design driver and significant growth opportunity, where the pace of innovation needs to be high to effectively address these constraints. We at Saras Micro Devices remain focused on delivering the embedded passive solutions needed to enable the next generation of power-delivery architectures.

Eelco Bergman, Chief Business Officer
Saras Micro Devices
https://www.sarasmicro.com/

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