semiconductor
packaging news
Sponsor
XYZTEC

Magazine loader to test lead frames
Hands-free automatic bond testing with a Sigma MAG magazine handler. Optional with SEMI S2 safety cabinet and/or loadport for top and front-loading (OHT and AGV).
xyztec
IMAPS
Viewpoint
January 14, 2026

VIEWPOINT 2026: Nitin Parekh, CEO, Via Automation



Paving the Way for Resilient Supply Chains

VIEWPOINT 2026: Nitin Parekh, CEO, Via Automation
Nitin Parekh, CEO, Via Automation
In today's semiconductor industrial landscape, downtime is more costly than ever. Unplanned machine downtime cost manufacturers more than $1.5 trillion globally per year. The cost of a single hour of downtime has surged by 50% in just two years.

Similarly, semiconductor manufacturing is inefficient due to complex chip designs and the need for nanoscale precision. Manufacturers, semiconductor fabs and energy providers are all looking for ways to maximize uptime, extend equipment life and reduce unexpected failures. Traditional solutions rely on dashboards and complex visualizations that don't solve the root problem.

Predictive maintenance powered by AI, automation and edge connectivity can change this. The use of artificial intelligence and generative AI chat are emerging as game-changers for enterprises looking to be more efficient and cost effective by implementing predictive maintenance at scale.

As the complexity of equipment and unexpected failures grows exponentially, the challenges of traditional maintenance are hard to ignore. Maintenance strategies for decades have been reactive—fix after failure—or preventive by relying on scheduled servicing. Both have unmistakable limitations that no longer work. Reactive maintenance leads to costly downtime and safety risks, while preventive maintenance often results in unnecessary part replacements and wasted labor.

Nitin Parekh, CEO
Via Automation
https://getvia.ai/
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
Amkor-Technology