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Hi-Rel Hermetic Package Sealing
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| Viewpoint |
January 8, 2026
VIEWPOINT 2026: Brent Fischthal, Head of Global Marketing Communications, Koh Young Technology, Inc.
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Brent Fischthal, Head of Global Marketing Communications, Koh Young Technology, Inc.
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On-Device AI and the Next Leap in Advanced Packaging Metrology
Advanced packaging continues to reshape the semiconductor landscape, and the demands on metrology are rising just as quickly. As device architectures grow more intricate and materials push physical limits, process windows are tightening. The industry can no longer rely on periodic sampling or offline analysis. What is needed is immediate insight that keeps pace with production.
At Koh Young, we are expanding what real-time 3D measurement can deliver by embedding AI directly into the metrology workflow. Instead of treating inspection as a checkpoint, we are using it as a continuous intelligence layer that interprets variation, predicts drift, and guides corrective action in the moment. This shift is helping bridge the gap between design intent and process capability, especially for advanced packaging steps where micron-level accuracy defines final device performance.
Looking ahead to 2026, on-device AI will become fundamental to achieving stable, repeatable processes across heterogeneous integration, fine-pitch interconnects, and new materials. The opportunity is clear: metrology that not only measures but understands, adapting to manufacturing complexity with speed and precision. This is how the next generation of semiconductor manufacturing will evolve.
Brent Fischthal, Head of Global Marketing Communications
Koh Young Technology, Inc.
http://www.kohyoung.com
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Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
Brewer Science
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