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February 13, 2025
VIEWPOINT 2025: Akihiko Hamada, President & CEO of Nidec SV Probe
In 2024, we made significant advances with our MEMS probe product line, added new equipment to boost our capabilities and released two new probe card technologies. One, a Thermocouple probe to measure accurate device surface temperature, and the other, a Chamber Head Probe Card which suppresses damages from sparking due to high voltage and elevated temperature, both ideal for Power and Automotive. In May, we began a collaboration with Synergie Cad Group, a designer and manufacturer of PCBs, probe cards and turnkey test solutions. And, like most global companies, we also experienced the effects of the US ban on China products. To minimize the disruption for our customers in the region, we optimized manufacturing capabilities at our China facility and tailored our production portfolio to function without US resources. Providing customers with innovative, quality, cost-effective testing solutions for the fast-paced semiconductor industry remains vital moving into 2025. Nidec SV Probe will continue the expansion of our in-house manufacturing and the ongoing development of our product technologies targeting AI, HPC and Automotive. As a test solutions provider we will concentrate on requirements for KGD, Wafer Level Burn-in and Advanced Packaging. We believe Advanced Packaging will continue to dominate as semiconductor devices get smaller, denser, and more complex. Tighter pitch and higher parallelism will remain important, but test temperature, high voltage and high current all must be considered to ensure the performance and efficiency of the device. Nidec SV Probe will be ready to support our customers and ensure our product technologies align with the industry's needs and constant evolution. Akihiko Hamada, President & CEO Nidec SV Probe http://www.nidecsvprobe.com |
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