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Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
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| Viewpoint |
February 7, 2025
VIEWPOINT 2025: Eelco Bergman, Chief Business Officer, Saras Micro Devices
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Eelco Bergman, Chief Business Officer, Saras Micro Devices
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In 2024, we witnessed a strong rebound year for the semiconductor industry, with the latest WSTS forecast showing 19% YoY growth, achieving a global market value of $627 billion. Much of this growth has been driven by the promise of AI and the significant data center investments made to support its deployment, fueling the demand for leading-edge accelerator, processor, and high bandwidth memory devices. As a result, for the first time, we saw a semiconductor company achieve a $1 trillion market capitalization, a level which had previously been achieved by the leading FAAMG companies.
Looking ahead, WSTS is predicting that the market will grow another ~ 11% in 2025 to $697 billion, again largely due to investment in AI infrastructure and products. While it’s clear that AI represents the next ‘killer app’ for the industry, it’s also evident there are commercial (ROI), infrastructure (grid capacity), supply chain (advanced manufacturing capacity), and technical challenges (power/thermal) remaining for AI to reach its full potential. As the saying goes, challenges represent opportunities and, knowing our industry, these opportunities will be seized and addressed.
At Saras Micro Devices, we are tackling the device power delivery and efficiency opportunity. Our package substrate & PCB embeddable passive and voltage regulation modules (SarasTile or STILE) will enable a new generation of power delivery architectures for AI processor and accelerator applications. We look forward to bringing our products to market and delivering AI power with STILE.
Eelco Bergman, Chief Business Officer,
Saras Micro Devices
https://www.sarasmicro.com/
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Chemically Resistant, UV Curable Epoxy
Master Bond UV26SP is a low outgassing UV curing system with high temperature and chemical resistance for bonding, sealing and coating.
Master Bond
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