VIEWPOINT 2024: Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI, Mycronic Group

Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI, Mycronic Group

2023 was an exciting year for MRSI as our business started to recover from Covid, and we have achieved good business results despite the global economic downturn. The forecasted demand of global optical transceivers, one of our main market segments, was revised downwards at the beginning of the year.

However, a new wave of investment in artificial intelligence (AI) infrastructure boosted demand for 400G and 800G transceivers in Q3 2023, resulting in higher demand for high-speed optical modules and increased demand for high precision die bonding equipment.

Looking ahead to 2024, the artificial intelligence (AI) infrastructure brings more demand from optical modules for GPU-to-GPU connectivity or optical connectivity to TPUs. The forecast demand for optical modules for AI will double in 2024 compared with 2023, and is expected to maintain a high CAGR for the next few years. With the increased demand for optical modules, there will be an increased demand for high-precision die bonding equipment. We believe AI related industries will all have good business prospect in the following years.

MRSI, Mycronic Group is a global high-tech equipment company. We have been investing in die bonding assembly solutions for different packaging applications, and expanding the product capabilities through continuous innovation to support our customers. Every year, we introduce new high-precision die bonding products or solutions to support new requirements from our customers.

Notably, MRSI set up a product development team in China in 2023, which works with key customers to develop new high-precision assembly product platforms and plans to release two new product platforms globally in 2024, in line with MRSI’s global business strategy to support more customers’ growth in the coming years.

As the global economy faces uncertainty, technological development will nonetheless continue. MRSI will seize the business opportunities of high-precision die bonding solutions in our traditional fields, such as optical communication, LiDAR, defense & aerospace, RF & Microwave, and medical, and will actively develop advanced semiconductor packaging equipment to serve more diverse applications fields.

Dr. Limin Zhou, Senior Director of Strategic Marketing
MRSI, Mycronic Group
http://www.mycronic.com

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