February 6, 2024
VIEWPOINT 2024: Bob LePage, Sales Engineer, Circuit Technology Center
Component Lead Form and Trim capability was added to our lineup of service offerings. We can now trim and form component packages to your pre-assembly specifications. Post-forming lead tinning and gold removal services are also offered.
Demand for our BGA component re-balling services increased yet again in 2023. We now have enormous re-balling capacity, industry-leading expertise, and flexibility to support BGA re-balling requirements.
Customized Robotic Hot Solder Dip technology is utilized for electronic component tinning applications. Additional machine options were implemented to support difficult-to-handle components.
Of course, we continue to enhance our circuit board damage repair and rework services, for which we are so well known.
Thanks to our dedicated and highly skilled staff of rework and repair professionals, Circuit Technology Center celebrated our 40th year in business in 2023. After 40 years, we are still here, staffed with the industry's best, and we are proud to be considered the industry’s most reliable and trusted source for circuit board and component rework, modification, damage repair, and BGA re-balling services.
Bob LePage, Sales Engineer
Circuit Technology Center
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