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| Viewpoint | ||
January 29, 2024
VIEWPOINT 2024: Ira Leventhal, Vice President of Applied Research and Technology, Advantest America, Inc.
Semiconductor packaging technology is advancing in multiple complex ways as we move squarely into the heterogenous integration and chiplet age. Packaging technology breakthroughs such as 2.5/3D structures, hybrid bonding, backside power delivery, and high-density interconnect substrates enable the next level of performance gains but also bring new and more complex failure mechanisms. Advantest is proactively providing solutions to these challenges as we continue to shift the role of test from functionality and quality verifier to critically important enablers of semiconductor innovation. In addition to continued advancements in electronic, interfacing, handling, and thermal management technology, our Real-Time Data Infrastructure (RTDI), including high-performance secure edge compute capability, enables advanced machine learning algorithms to be integrated into our customers’ test flows. Real-time decisions can now be made on a combination of data from design, process, test, equipment, and even in-field, providing innovative solutions to advanced packaging-related challenges. These include the ability to accurately pinpoint and root cause failures, predict final package yield, and enhance performance and yield through die matching and shift-left of failure detection. As we move into 2024, we look forward to working in strong collaboration with our customers and industry partners to fuel the next wave of semiconductor industry innovation and growth. Ira Leventhal, Vice President of Applied Research and Technology Advantest America, Inc. http://www.advantest.com |
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