VIEWPOINT 2024: Andy Behr, Technology Manager, Panasonic Electronic Materials

Andy Behr, Technology Manager, Panasonic Electronic Materials

2023 was a busy year for the IC Packaging Industry writ large and for Panasonic Electronic Materials as well. Ignited by AI adoption, the Networking/Data Center sector drove significant growth and activity for both our printed circuit board and IC Packaging business units.

Geographically, we're not yet experiencing a broad-based return of IC Packaging or PCB fabrication to the United States precipitated by the CHIPS act, but these large-scale government programs, aimed at revitalizing critical industry sectors, typically take years to gain tangible momentum.

In the realm of IC packaging designs, leading-edge transistor fabrication is moving into the sub 5 nm nodes and package densities are increasing dramatically to keep up. Glass cores, chiplets, substrate embedded passives, and optical transmission technologies are gaining traction and our R&D teams have been working overtime to deliver breakthrough materials to enable these developments.

As we move into 2024, we’re expecting market conditions generally to continue to rebound. Geopolitical concerns will drive shifts in manufacturing locations, while the semiconductor packaging and other industries grapple with environmental factors such as pending PFAS legislation in the US and Europe.

Given our position as a premier supplier of high-performance/high-quality IC Packaging materials, Panasonic is ready for this future.

Andy Behr, Technology Manager
Panasonic Electronic Materials
https://na.panasonic.com/us/

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