Viewpoint
February 20, 2023

VIEWPOINT 2023: Neil O'Brien, General Manager, Finetech



VIEWPOINT 2023: Neil O'Brien, General Manager, Finetech
Neil O'Brien, General Manager, Finetech
2022 was an eventful year for Finetech. Our colleagues in Germany with Ukrainian and Russian roots, had to deal with the sad reality of the Ukraine invasion. I am proud to share that Finetech GmbH reacted swiftly and donated 50,000 EUR to an emergency Ukraine aid fund.

Finetech celebrated its 30th anniversary with a summer party in Berlin. As the pandemic eased, it was wonderful to be back in person with so many long time colleagues and friends. We are so thankful for our loyal customers and partners who have placed their trust and confidence in Finetech for over three decades.

At our eastern U.S. facility in Amherst, NH, we built a new Class 1000 clean room space which strengthens our application and support capability. This is part of our mission to provide local, "real world" bonding, process development, prototype services and customized training.

As we move into 2023, Finetech has continued the introduction of its next generation FINEPLACER® tabletop die bonding systems. First with Lambda2, and now the Pico2. The journey from R&D and prototype, to production is now easier. Our IPM Command software gives users the building blocks for precise assembly steps across our complete product line. The Femto2 fully automated system continues to set itself apart with its ease of use, flexibility and incredible accuracy of 0.3µm. There is much to look forward to in our 4th decade.

Neil O'Brien, General Manager
Finetech
https://www.finetechusa.com/
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address