Viewpoint - Ramachandran “Ram” K. Trichur
February 22, 2023

VIEWPOINT 2023: Ramachandran "Ram" K. Trichur, Global Market Segment Head, Henkel

VIEWPOINT 2023: Ramachandran
Ramachandran “Ram” K. Trichur, Global Market Segment Head, Semiconductor Packaging Materials, Henkel
We started 2022 on the heels of what I call a 'magical year' in the semiconductor packaging market, with unprecedented demand from all sectors — consumer electronics, 5G, and automotive — converging in 2021. It was a record-setting performance for the industry that will be hard to reproduce. Because of this, the mid-single digit semiconductor market growth of 2022, while healthy, paled in comparison.

Nevertheless, Henkel's semiconductor business performed well due to our strong wirebond packaging solutions for the automotive and industrial segments, alongside continued investment and wins in advanced packaging for data processing applications.

Over the course of 2022, Henkel's electronics business launched several strategic semiconductor products that are enabling our customers' innovation initiatives. Three new high-reliability die attach materials led the pack: a BOM simplification film for lead frame and laminate packages, a high-thermal non-sintering 30 W/m-K material, and a 165 W/m-K pressure-less sintering formulation.

Notably, we also developed a leading-edge Si node capillary underfill that is now being used in premium-tier smartphone packages. In addition, Henkel continues to invest in manufacturing and engineering centers around the world. The company's Inspiration Center Düsseldorf opened its doors, we inaugurated an electronic solutions manufacturing facility in Korea, and added two new application engineering centers in key regions — one in Northern California and one in South China — to support electronics customers.

Market analysts are projecting a challenging 2023, with growth flat or in low positive territory depending on China's return to productivity. Despite this, Henkel will not slow ongoing investment in new semiconductor materials development.

We are looking beyond the short-term horizon and developing products to support our customers with innovative wirebond and advanced packaging solutions for long-term success.

Ramachandran “Ram” K. Trichur, Global Market Segment Head, Semiconductor Packaging Materials
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