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| Viewpoint | ||
February 3, 2022
VIEWPOINT 2022: Dennis Chen, Global Business Director, Advanced Packaging Technologies, DuPont Electronics & Industrial
To support growth in 2021 and future years, we've added talents from the field to our team in every region. We continue to adapt and embrace the hybrid working model we had implemented even before the pandemic, so our employees can have a flexible working environment while meeting the needs of our customers. Our team resumed attending in-person regional conferences and meeting with customers face to face in 2021 — when deemed necessary and in full compliance with public health guidelines. It is worth noting that the level of sophistication the electronics industry has reached in offering hybrid conferences, virtual and in-person, will go a long way in garnering higher participation and propelling innovation in the areas of heterogeneous integration of 2.5D/3D packages. Just as we have seen how our networked, global DuPont team successfully leveraged a hybrid meeting model for cross-border coordination to drive engagement and strengthen relationships with our customers in 2021, we expect the hybrid meeting trend to continue. Looking ahead, we're optimistic about 2022. We see heterogeneous integration continuing to gain momentum as new designs for 2.5D/3D packaging are being considered for many new developments in high-performance computing and AI-related chips. Data centers, 5G connectivity and the automotive sector are key drivers for growth. Our team is closely following these trends, collaborating with our customers to keep pace with the markets and ensure that we're making the right investments to provide solutions for the future. Dennis Chen, Global Business Director, Advanced Packaging Technologies DuPont Electronics & Industrial http://www.dupont.com/ |
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