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January 28, 2022
VIEWPOINT 2022: Andy Behr, Technology Manager, Panasonic Electronic Materials
Our team worked diligently to meet customer demand and I would like to recognize their extraordinary efforts to exceed our customer expectations. Heading into 2022, our business expects steady growth to meet pent-up demand across most industry sectors and we foresee robust growth in network infrastructure as 5G deployment continues. We also anticipate significant opportunity in new materials that enable high-speed system development. For example, package-level thermal challenges from high speed/high density flip-chips are driving growth of our thermally conductive molded underfills. Our new FC BGA substrates combine ultra-low CTE properties with a unique stress release polymer technology to decrease warpage and deliver increased board-level reliability for larger packages. Panasonic will continue leading-edge development of high-speed, low-loss, high-layer-count motherboard laminates -- the backbone of many communication systems. Although the "new normal" of the post-pandemic world won't be the same as pre-pandemic environment, we are adapting to a changing environment and will continue delivering best-in-class packaging materials to customers in 2022 and beyond. Andy Behr, , Technology Manager Panasonic Electronic Materials https://na.panasonic.com/us/ |
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