|Viewpoint - Rob Kavanagh|
February 19, 2021
VIEWPOINT 2021: Rob Kavanagh, Global Business Director, Advanced Packaging Technologies, DuPont Electronics & Imaging
The need for data-driven technology accelerated as working from home, online schooling, shopping, and telemedicine become the new normal. This demand drove the broad adoption and development of more complex chip technologies and advanced packaging architectures. 2020 was a proof year for 3D ICs, and chiplet integration technology is now on the roadmaps of all the top-tier manufacturers.
At DuPont, we pivoted quickly to ensure we continued operations safely. Like other companies vital to the semiconductor supply chain, we are adapting the way we operate, keeping the safety and well-being of our people top of mind while continuing to meet the needs of our customers. Continuing development projects and a high level of technical support was just as important as maintaining production levels. We leveraged our global footprint to apply learnings from our facilities around the world and worked collaboratively from a distance.
As vulnerabilities in the global semiconductor industry supply chain were exposed, teams worked quickly to secure and strengthen them. Before the pandemic, 2020 was expected to be a recovery year for advanced packaging, and the pandemic did not prevent this. As demand increased, we delivered.
Looking ahead, we know that the events of 2020 will permanently impact the semiconductor industry and how we do business. We're continuing to strengthen our supply chain, learning new ways of engaging customers, and, for those of us working from home, perhaps reconfiguring our home offices to look better on video chat. We are optimistic about 2021 and look forward to delivering the advanced materials needed to support increasingly complex packaging technologies.
Rob Kavanagh, Global Business Director, Advanced Packaging Technologies
DuPont Electronics & Imaging
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