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Viewpoint | ||
February 9, 2021
VIEWPOINT 2021: Matt Wilson, VP of Sales, Royce InstrumentsLooking forward to 2021 we see demand for equipment that can precisely and repeatably handle unique devices such as MEMS, RF, Optoelectronics, thin and odd shaped devices along with the need for the equipment to ensure the quality of the product. As R&D facilities focus on developing the next generation components, it is critical for them to have equipment that can be flexible to handle a variety of inputs and outputs, while at the same time offering value-add processes such as high-resolution inspection (2D and 3D), electrical test and even specialty assembly processes. Production facilities around the globe are requiring equipment to ensure "known good devices" by integrating a variety of high speed inspection and test solutions before components get placed into their final output package. At V-TEK Inc, our Royce Instruments product line supports niche semiconductor manufacturing in both the Die Sorting and Bond Testing application spaces. Our V-TEK International product line supports far-back end component handling for low to medium volume applications. Together we deliver a comprehensive solution for companies that need to move electronic components, ranging from wafer-based to bulk with placement into all standard formats such as waffle packs, gel packs, carrier tape, trays and even tubes. Matt Wilson, VP of Sales Royce Instruments http://www.royceinstruments.com |
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