|
|
Viewpoint | ||
February 17, 2020
VIEWPOINT 2020: John Park, Product Management Group Director, CadenceFoundries and OSATs will continue to battle for market share, driving cost (the key metric) lower for state-of-the-art multi-chip(let) packaging. This will greatly accelerate the transition to multi-chip(let) packaging and heterogeneous systems as an alternative to CMOS scaling. The evolution of Moore's Law is about more than just the limitations of physics. Chasing the latest design node is expensive, hard and requires large design teams. Big chips typically don't yield very well either. Fewer and fewer companies want to take on these challenges when a viable alternative in packaging is so readily available. John Park, Product Management Group Director, IC Packaging and Cross-platform Solutions Cadence http://www.cadence.com |
We search for industry news so you don't need to. | ||
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|