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| Viewpoint | ||
January 23, 2020
VIEWPOINT 2020: Andy Behr, Technology Manager, Panasonic Electronic Materials
One of the primary and on-going challenges facing designers of emerging high-performance packaging schemes is the effective management of thermally-induced warpage and the resultant internal device stresses. Panel and package level warpage are the root cause of innumerable packaging, assembly and reliability issues. To make matters worse, current design trends like increasing die-to-package ratios, panel level packaging, thinned die, stacked die, low-profile mold caps, system in package (SIP) constructions and decreasing interconnect pitch render effective warpage management increasingly difficult to achieve. The ability to control and balance material properties and complex interactions is essential to addressing these packaging problems. The research team at Panasonic Electronic Materials has deep competency in novel resin formulation, inorganic components expertise and the proprietary manufacturing processes required to optimize crucial mechanical properties like Tg, modulus, and CTE that significantly influence package warpage. Launches slated for 2020 include low CTE/low stress/ultra-thin IC packaging substrates and liquid molded underfill products. Andy Behr, Technology Manager Panasonic Electronic Materials https://na.panasonic.com/us/ |
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