|Viewpoint - Michael Chalsen|
February 19, 2020
VIEWPOINT 2020: Michael Chalsen, Sr. VP Assembly Solutions Global Technologies, Mycronic
MRSI recently improved the accuracy to 1.5 micrometers for the MRSI-H/HVM-Series die bonders. The MRSI-HVM with a heated head is a great solution for 400G+ and other high-density applications that need localized heating. The MRSI-H-TO high-speed product is designed for complex TO-can photonic devices for 5G wireless, such as WDM & EML-TOs. And, the MRSI-H-LD is a full solution for RF / Microwave power devices as well as high-power laser diode chip and bar applications.
By covering the spectrum of volume and applications, our "One-Stop-Shop" solutions ensure our customers deliver just-in-time supply and fast-pace innovations of critical photonic components, for high-growth market segments such as hyperscale data centers, 5G wireless, LiDAR, VRAR, and automotive photonics.
Michael Chalsen, Sr. VP Assembly Solutions Global Technologies
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