Viewpoint - Michael Chalsen
February 19, 2020

VIEWPOINT 2020: Michael Chalsen, Sr. VP Assembly Solutions Global Technologies, Mycronic



VIEWPOINT 2020: Michael Chalsen, Sr. VP Assembly Solutions Global Technologies, Mycronic
Michael Chalsen, Sr. VP Assembly Solutions Global Technologies, Mycronic
MRSI Systems, part of Mycronic's Assembly Solutions Global Technologies division, enters 2020 with the completion of the MRSI-H/HVM-series product line which complements our traditional market-leading MRSI-705 and MRSI-M3 products for R&D/medium volume production. The MRSI-H/HVM-series product line is targeted towards high-volume applications driven by 5G wireless, data center, telecommunication, industrial lasers, and emerging markets of LiDAR and VR/AR.

MRSI recently improved the accuracy to 1.5 micrometers for the MRSI-H/HVM-Series die bonders. The MRSI-HVM with a heated head is a great solution for 400G+ and other high-density applications that need localized heating. The MRSI-H-TO high-speed product is designed for complex TO-can photonic devices for 5G wireless, such as WDM & EML-TOs. And, the MRSI-H-LD is a full solution for RF / Microwave power devices as well as high-power laser diode chip and bar applications.

By covering the spectrum of volume and applications, our "One-Stop-Shop" solutions ensure our customers deliver just-in-time supply and fast-pace innovations of critical photonic components, for high-growth market segments such as hyperscale data centers, 5G wireless, LiDAR, VRAR, and automotive photonics.

Michael Chalsen, Sr. VP Assembly Solutions Global Technologies
Mycronic
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