|Viewpoint - Barmak Mansoorian|
January 9, 2015
Barmak Mansoorian, President & Co-Founder, Forza Silicon
We have always been more than an engineering design house, we have the technology knowledge and foundry experience to help our clients with their most difficult processes and production requirements for customized imaging solutions. When considering the constant changes in technology advancements, the depth of experience in IC design and production services that Forza offers is more important than ever in 2015.
We expect strong and steady growth in the CMOS image sensor market, particularly for consumer applications (wearable, mobile), automotive imaging, machine vision, security & surveillance and medical imaging. According to a recent Yole Développement report, the CMOS image sensor market is forecasted to reach $13B by 2018 (10% CAGR). The report suggests image sensors are undergoing numerous technological innovations as companies strive for smaller pixels to achieve better resolution. It will require heavy process and design innovations to overcome performance degradation to move to advanced pixel technology while maintaining high sensitivity. Forza has positioned itself as a market leader in image sensor design and is ready to tackle new challenges for our customers to differentiate their product from off-the-shelf solutions.
The recently introduced Forza Reconfigurable Image Sensor Technology Platform, utilizing advancements in stacked chip technology, is an example of how advanced imaging technology can be leveraged into real value for our customers. The image sensor has numerous reconfigurable capabilities and can be programmed to perform multiple monitoring and decision-making tasks at the sensor "edge." It can be configured to integrate into different product applications and can be reconfigured to include more features and capabilities in the existing device. The technology provides a low-power, compact, multi-function sensor solution that is cost-effective and accelerates time-to-market.
Furthermore, we believe 3D wafer stacking is the next step for image sensors. Forza is already on the leading edge of 3D integration imaging techniques to drastically improve system performance to levels once thought impossible. We’ve applied this technology in our projects with the DARPA SCENICC Program: Soldier Centric Via Computational Cameras and other DoD initiatives.
Our commitment to progressive technology and high-quality products will enable us to provide our customers with a complete design and production services solution for many years to come.
Barmak Mansoorian, President & Co-Founder
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