January 27, 2014
Kevin Becker, VP Product Development & Engineering, Henkel Electronics LLC
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Kevin Becker, Vice President of Product Development & Engineering, Henkel Electronic Materials LLC
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Moores Law, which dictates
the doubling of transistors on a chip every 24 months, shows no signs of being
disproven anytime soon. At Henkel, we see the advance of Moore's Law on a daily
basis with the added challenge of increasing IO counts in higher and higher
densities (i.e. more IOs on smaller footprints). The ability to cope with the
demands these conditions place on semiconductor packaging specialists is at the
center of our development efforts and what clearly differentiates Henkel
competitively.
Henkel was the first to
launch a conductive die attach film (cDAF) to enable greater packaging
densities for leadframe packages and this work has continued with several new
materials added to the cDAF portfolio in the last year. Package interface will
start to move from traditional ball attachment to formats such as copper pillar
that are more conducive to higher densities.
With this shift comes a change in
underfill systems, as traditional capillary materials aren’t always effective. To
address this, Henkel has continued our work with novel non-conductive paste
(NCP) materials and we will launch new NCP systems with even greater
performance in 2014. These materials, in addition to die attach pastes, novel
clear conductive inks for displays and mold compounds for power packages will
be market ready next year.
Handhelds continue to be
the primary semiconductor market driver and Henkel doesn't anticipate anything
changing in this regard over the next 12 – 18 months. Semiconductor market
projections for 2014 are mostly positive and Henkel expects to be a major
contributor to semiconductor advances.
Kevin Becker, Vice President of Product Development & Engineering
Henkel Electronic Materials LLC
http://www.henkel.com/electronics
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