February 11, 2013
Joseph S. Bubel, President, The Americas, Hesse Mechatronics
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Joseph S. Bubel, President, The Americas, Hesse Mechatronics
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Effective
January 1, 2013, Hesse & Knipps will become Hesse Mechatronics. This change
is a move back to the company's roots, named Hesse GmbH when first launched in
1986. The new name signifies more accurately what we do -- which is to develop
and manufacture the most advanced thin wire wedge bonders and heavy wire
bonders in the world utilizing mechatronics, or a multidisciplinary engineering
approach. Our outlook for 2013 in the Americas includes:
- Maintaining our
leadership position in the world market for fully automatic thin wire wedge
bonding equipment
- Significant
growth in market share for our heavy wire bonder business
- Heavy investment
in R&D, with some exciting product announcements planned for 2014
Power
semiconductors and power modules will continue to grow the heavy wire bonder
market in 2013. Our new BONDJET BJ931L Dual Head Heavy Wire Bonder, making its
debut at SEMICON Shanghai, and our BONDJET 935/939 Series, are well positioned
to serve these markets.
Worldwide,
the strongest growth will occur in the power module segment for automotive,
energy and other industrial applications with an increase in manufacturing
focus in the Americas. To support the increasing business in this region, we
will continue to invest in growing and training our technical support and sales
staff.
In short, we
look forward to an exciting year for wire bonding in 2013 and beyond!
Joseph S. Bubel, President, The Americas
Hesse Mechatronics
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