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packaging news
Sponsor
Brewer-Science

Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
Ontos-Equipment-Systems
Press Release
September 1, 2023  -  Click the title to read the full press release.

Brewer Science unveils advanced packaging solutions at SEMICON Taiwan 2023



Brewer Science, Inc., will present new developments in temporary and permanent bonding material technologies for advanced packaging this week at Asia's two premier ...

Brewer Science, Inc
December 8, 2025
Presentation Highlights High-Temp-Stable Temporary Bonding and IR Laser Debonding with Si Carriers
Brewer Science, in collaboration with EV Group (EVG) and Fraunhofer IZM ASSID, will co-present groundbreaking research on ultrathin wafer handling at WaferBond ’25 ...
November 11, 2025
Brewer Science Showcases Advanced-Node and Wafer-Thinning Materials at SEMICON Europa
Brewer Science, Inc. will exhibit its latest advancements in sustainable lithography processes at SEMICON Europa 2025. Attendees are invited to visit Brewer Science ...
September 29, 2025
Brewer Science Expands U.S. Operations with New Chandler, Arizona Office and Lab
Brewer Science, Inc. announces the opening of a new office and lab in Chandler, Arizona: the Brewer Science Arizona Innovation Center. This expansion strengthens the ...
September 9, 2025
Participating in the Next-Generation Semiconductor Packaging Consortium "JOINT3"
JOINT3 is a co-creation evaluation platform established by Resonac Corporation with the aim of accelerating the development of materials, equipment, and design ...
August 29, 2025
Brewer Science Presents Materials' Impact in Sustainable Processes, AI, and High-Performance Computing
Brewer Science, Inc. will share its expertise on the impact materials have on sustainable lithography processes. Additionally, Brewer Science will present the role innovative ...
August 14, 2025
Brewer Science Supports the Restoration of Full R&D Tax Deductibility with the Passage of OBBB
Brewer Science celebrates the restoration of 100% tax deductibility for research and development (R&D) expenses with the passage of the One Big, Beautiful Bill (OBBB). ...
August 12, 2025
Brewer Science Named 2025 National Top Workplace in Manufacturing Industry
Brewer Science, Inc. has been named a 2025 National Top Workplace in the Manufacturing Industry, marking the fifth consecutive year the company has received this recognition. ...
June 10, 2025
Brewer Science Presents Materials Innovation for Additive Electronics at TechBlick 2025
Brewer Science, Inc. is presenting "Building Circuits from the Ground Up: Materials Innovation for Additive Electronics at TechBlick: The Future of Electronics Reshaped" in Boston ...
May 15, 2025
Brewer Science to Showcase Advanced Material Innovations at CS MANTECH and ECTC 2025
Brewer Science, Inc. will present innovations in temporary bonding materials at two premier conferences this May: CS MANTECH 2025 and the 75th Electronic Components ...
May 8, 2025
Brewer Science releases Impact Report 2025
Brewer Science releases its Impact Report 2025, detailing the company's efforts in sustainability, social responsibility, and governance, also referred to as an ESG Report. ...
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Sponsor
Henkel-AG-Co

Is copper sintering the future of WBG semiconductors?
Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology.
Henkel AG & Co.
Pac-Tech