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November 4, 2019  -  Click the title to read the full press release.

Atotech to participate in productronica and SEMICON Europa 2019 in Munich, Germany
Atotech announced that it will participate in the productronica and SEMICON 2019, in Munich from November 12 – 15. Atotech experts from whole of Europe will be present ...

Atotech
November 4, 2019
Atotech to participate in productronica and SEMICON Europa 2019 in Munich, Germany
Atotech announced that it will participate in the productronica and SEMICON 2019, in Munich from November 12 – 15. Atotech experts from whole of Europe will be present ...
October 1, 2019
Atotech to participate in the 52nd IMAPS in Boston
Atotech will present at the 52nd International Symposium on Microelectronics, held at the Hynes Convention Center in Boston, Massachusetts, from September 30 ...
September 17, 2019
Atotech to present at the SEMICON Taiwan 2019 in Taipei
Atotech is pleased to announce its participation in this year's SEMICON Taiwan. The exhibition will be held at the Taipei Nangang Exhibition Center from September 18 – 20 ...
May 23, 2019
Atotech to present semiconductor advanced packaging solutions and innovations at ECTC 2019
At this year's IEEE 69th Electronics Components and Technology Conference (ECTC) Atotech will be presenting its product lineup, roadmap and a technical paper ...
November 27, 2018
Atotech to present at the Electronics Packaging Technology Conference
Atotech will present at this year's Electronics Packaging Technology Conference (EPTC) held at the Resorts World Sentosa in Singapore from December 4 to 7, 2018. ...
November 13, 2018
Atotech product experts to present at SEMICON Europa and electronica 2018
Atotech Group will exhibit and present its latest products for power, automotive, and mobile semiconductor applications at this year's SEMICON Europa. Atotech's ...
October 9, 2018
Reducing manufacturing costs on Fan-Out Panel-Level Packaging
"Upscaling panel size for copper plating on FO-PLP applications to reduce manufacturing cost" will be the topic of Atotech's presentation at this year's iMAPS ...
September 7, 2018
The next revolution in electroless copper for advanced FPCB is now available
Atotech introduces a new horizontal electroless copper process specifically developed to ensure a blister-free electroless copper deposition and shiny surface ...
September 5, 2018
Atotech to exhibit and present at the SEMICON Taiwan
Atotech announced its participation at this year's SEMICON Taiwan Show, held from September 5 to 7, 2018, in the Taipei Nangang Exhibition Center Hall 1 in Taipei, Taiwan ...
May 22, 2018
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two ...