Press Release - Yole Développement
May 19, 2017  -  Click the title to read the full press release.

New applications are driving materials & design innovations for power module packaging



The power packaging materials is today the main part of the power module cost. Therefore, in 2016 almost 40% of the total cost is due to the cost of materials for packaging. ...

Yole Développement
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address