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| Press Release - LPKF Laser & Electronics | ||||
June 9, 2016
New Laser Solutions for Innovative Interconnects at Semicon WestTualatin, OR -- LPKF Laser & Electronics has announced it will exhibit at Semicon West which will be held July 12-14 at The Moscone Center in San Francisco, CA. LPKF, a leading manufacturer of laser systems for electronics manufacturing, will showcase its new solutions across the semiconductor packaging spectrum in booth 6257. One of the technologies highlighted by LPKF is the efficient via forming in large glass substrates (TGV); a process of creating through holes and blind vias, with defined diameters as small as 15 microns, using single-pulse glass modification through laser beam in combination with a subsequent standard wet etching process. Glass substrates with a thickness of 50 to 500 micron can be processed with this method. Clean-room compatibility and stress-free processing make this innovative laser-based process ideal for thin glass interposers and also for solid glass cores for FCBGA substrates - eliminating chips, burrs, micro-cracks or voids. LPKF has developed the new Vitrion laser system specifically for these applications. The system is designed for high volume mass production, capable of forming more than 5,000 homogeneous vias per second. Another technology represented at Semicon West will be Laser Direct Structuring (LDS-technology) for MEMS applications, a method of creating ultra-fine circuits directly on 3D parts used for chip packaging. The highly flexible and stress-free laser direct structuring process is designed for advanced electronic packaging where space is a premium and high layout-flexibility is much appreciated. For more information on LPKF's semiconductor packaging technology solutions, visit LPKF in booth 6257 at Semicon West or visit www.lpkf.com. LPKF Laser & Electronics For more information visit: http://www.lpkfusa.com
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