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February 10, 2026
VIEWPOINT 2026: Thomas Rodgers, Senior Director of Market Strategy, ZEISS MicroscopyThe Top Failure Analysis Challenges for Advanced Packaging in 2026
But as heterogeneous integration becomes the new norm, failure analysis (FA) is becoming significantly more difficult. The very innovations that unlock performance are creating dense, multi-layered, multi-material structures that push traditional FA tools and methods to the edge. In 2026, the biggest challenges will stem from: • deeply buried structures • heterogeneous materials • multi-physics interactions • new interconnect technologies • chiplet-level system behavior New and emerging technologies, like CPO, tightly integrate lasers, modulators, photodiodes, and silicon photonics with high-power ASICs. This creates a set of FA challenges that engineers have never had to confront before—photonic failure modes located deep inside the package. In 2026, we will see more emphasis on cross-disciplinary engineering collaboration to solve these challenges. Multi-modal workflows will be increasingly necessary and will also leverage artificial intelligence to speed up FA—from data collection to defect localization to root-cause analysis. This evolution is essential for supporting the reliability, yield, and performance of next-generation devices. Thomas Rodgers, Senior Director of Market Strategy, Head of Business Sector Electronics ZEISS Microscopy http://www.zeiss.com/semiconductor-microscopy |
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