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February 5, 2026
VIEWPOINT 2026: Ramachandran "Ram" K. Trichur , Global Market Segment Head, Henkel
Across data center, mobile, and automotive, current packaging technologies are being pushed to their limits, underscoring the need for advanced solutions in pitch scaling, warpage control, thermal management, and high-throughput large-format processing. Henkel's portfolio of wirebond and advanced packaging materials is addressing these challenges directly, with multiple wins throughout 2025 and several innovative material launches anticipated in 2026. Last year, Henkel launched several products, including a silver sintering paste (Loctite Ablestik SSP 2040) for power module applications, a large die flip-chip capillary underfill (Loctite Eccobond UF 9100AA), and several die attach paste product upgrades under our sustainability initiative to eliminate PFAS. Looking to 2026 and beyond, Henkel's advanced packaging portfolio is enabling long-term growth in AI and HPC for cloud and mobile applications, with investments in underfills, adhesives, and encapsulation technologies that address thermal and mechanical stresses. Notably, Henkel will launch our first high thermal capillary underfill, specifically engineered for 2.5D and 3D advanced packages. Significant resources are also being directed toward wirebond packaging, extending Henkel's core competency in high-thermal, high-reliability materials for power conversion applications. Ongoing development programs target next-generation power modules and power discretes enabled by pressure-less sintering for large die and copper leadframe applications, as well as copper-based pressure-assisted sintering materials. Finally, in keeping with our responsible chemistry pledge, we are using a mass-balance approach to incorporate recycled silver into our materials, resulting in up to an 80% lower product carbon footprint. Through this initiative, Henkel sources 100% attributed recycled silver – there is no change in material flows and no requalification is required. The convergence era is upon us, with digital, physical, and biological systems coming together to reshape how we live, work, and communicate. Semiconductor advancements are the essential enabler, providing the critical link that turns technological innovations into everyday realities, and Henkel is proud to play a pivotal role in this evolution. Ramachandran “"Ram" K. Trichur, Global Market Segment Head, Semiconductor Packaging Materials Henkel http://www.henkel.com |
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