Sponsor

Medical Grade, Toughened Epoxy
Master Bond Supreme 121AOMed is a thermally conductive, electrically insulating adhesive that resists repeated autoclaving and is used for bonding, sealing and encapsulation.
Master Bond

Viewpoint

January 29, 2026

VIEWPOINT 2026: Tobias Königer, Head of Product Management Semiconductor Packaging, DELO Industrial Adhesives

Advanced Materials for Scalable and Energy-Efficient Photonic Integration

Tobias Königer, Head of Product Management Semiconductor Packaging, DELO Industrial Adhesives

Silicon photonics, or photonic integrated circuits (PICs), are emerging as a key enabler for next generation data communication and computing. By routing and processing signals with photons on a silicon platform, PICs drastically increase bandwidth while minimizing latency and power dissipation. These are critical advantages, as AI workloads and cloud infrastructures scale exponentially.

At the core of PIC performance lies advanced packaging and assembly. Sub micron alignment tolerances between optical components demand materials with exceptional curing properties, optical transparency, and thermal reliability. This is where adhesive technology plays a pivotal role.

Drawing on deep expertise in optical materials and wafer level processing, DELO develops photonic grade adhesives optimized for coupling efficiency. Aiming for the innovative technological approach of co-packaged optics, this requires CTE matching, dimensional stability and low outgassing performance. Our materials ensure reliable bonding interfaces that maintain optical alignment and signal integrity over temperature and lifetime stress.

In close cooperation with industry and research partners, DELO will continue to drive material innovations in 2026 and beyond that enable scalable, energy-efficient photonic integration and form the technological foundation for the data infrastructures of the future.

Tobias Königer, Head of Product Management Semiconductor Packaging
DELO Industrial Adhesives
http://www.delo-adhesives.com/us/

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

High Capacity & Power Plasma Systems
The BT-1 high capacity plasma systems features 5 shelves & high power plasma up to 5000 watts! Reactive Ion Etching chamber configurations with liquid cooling are also available.
Plasma Etch