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Copper vs silver: a turning point for WBG die attach
Copper sintering is challenging silver's dominance in power semiconductors. Read how new materials are enabling high performance at lower cost.
Henkel AG & Co.

Viewpoint

January 26, 2026

VIEWPOINT 2026: Michael Dube, Executive Vice President of Manufacturing Operations, Rochester Electronics

Michael Dube, Executive Vice President of Manufacturing Operations and Engineering, Rochester Electronics

In 2025, Rochester Electronics continued to scale U.S. manufacturing to meet rising demand for long-life-cycle semiconductor support. As a trusted U.S. partner, we provide turnkey solutions including design, die processing, assembly, packaging, and testing for automotive, industrial, medical, and military markets.

Our demand-based production model enables flexible output, minimizing inventory challenges and ensuring supply stability. We also help customers mitigate global risks, including tariffs and export restrictions, by maintaining all manufacturing and testing onshore.

In 2026, we are investing in complex hybrid package solutions and expanding our die processing, leadframe, leadless package, and lead finishing solutions.

To support this growth, we continue to build a skilled workforce through partnerships with universities and technical schools, backed by investments in facilities, equipment, and training.

Rochester remains the industry's most dependable source for long-term, secure semiconductor solutions.

Michael Dube, Executive Vice President of Manufacturing Operations & Engineering
Rochester Electronics
http://www.rocelec.com

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IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group