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High-Speed, Reliable Plating with PACLINE®
PACLINE® delivers high-throughput, precision electroless plating with full automation—ideal for UBM, RDL, and wafer-level packaging in semiconductor production. View Solution.
PacTech
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| Viewpoint |
January 22, 2026
VIEWPOINT 2026: Uwe Wagner, CEO. 3D-Micromac AG
Automation-Ready Sample Preparation: Strengthening Quality Assurance in 2026
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Uwe Wagner, CEO. 3D-Micromac AG
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In 2026, the semiconductor industry is entering a stage where quality assurance and failure analysis (FA) must operate with the same speed and scalability as the production lines they support. Advanced packaging, system-level integration, and shrinking process margins leave no room for delays in identifying root causes. The biggest barrier remains sample preparation—still often slow, manual, and limited by methods that were never designed for today’s manufacturing realities.
With this need in mind, we have developed microPREP® L, a laser-based platform that brings automated, scalable, and reproducible sample preparation closer to the fab. Supporting large-format samples and standardized workflows, it enables fast, precise, and stress-free material removal while ensuring consistent quality results. Automation helps reduce turnaround times and stabilizes downstream FA steps, allowing quality assurance teams to react more quickly and with greater confidence.
As manufacturers push for higher yields and faster ramps, automation-ready laser sample preparation will become essential for maintaining process stability. In 2026, strengthening quality assurance means adopting tools that support consistent, high-throughput workflows—not only to solve problems more quickly, but to prevent them.
Uwe Wagner, CEO
3D-Micromac AG
http://www.3d-micromac.com
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