semiconductor
packaging news
Sponsor
Ontos-Equipment-Systems

Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
Ormet-TLPS
Viewpoint
February 12, 2025

VIEWPOINT 2025: Jayson Moy, Director of Global Product Management, KYZEN



VIEWPOINT 2025: Jayson Moy, Director of Global Product Management, KYZEN
Jayson Moy, Director of Global Product Management, KYZEN
KYZEN has a long history of working with global leaders in the semiconductor and advanced packaging industries to develop cleaning materials that address the challenges that come with new technologies.

While production has primarily been in Asia, we see that other areas of the world are starting to implement policies that will bring the migration of Semiconductor manufacturing to their areas as the market expands.

The continuous need for faster and smaller devices drives new technologies in manufacturing semiconductor products, this is especially true for the quickly emerging AI industry and for those that use it. This has played a large role in paving the way for KYZEN to develop chemistries that will add value to the AI developers of process and hardware to enhance the reliability of their new technologies.

Several new chemistries are being launched this year within our Advanced Packaging product line. These are targeted towards emerging Semiconductor technologies, including AI. They will join a well-rounded Micronox product line to encapsulate the growing need to clean in a variety of applications.

With these product additions and the realization that Cleaning is a value-added benefit to their semiconductor manufacturing processes, our outlook for 2025 is optimistically hopeful and KYZEN will continue to address the needs of the industry as the technological leader in Cleaning.

Jayson Moy, Director of Global Product Management
KYZEN
http://www.kyzen.com
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Master-Bond

Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
Amkor-Technology