semiconductor
packaging news
Sponsor
Ontos-Equipment-Systems

Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
Ormet-TLPS
Viewpoint
January 13, 2025

VIEWPOINT 2025: Greg DeLarge, President, Plasma Etch, Inc.



VIEWPOINT 2025: Greg DeLarge, President, Plasma Etch, Inc.
Greg DeLarge, President, Plasma Etch, Inc.
As we close out another successful year, we reflect on the tremendous growth and innovation we and our customers have achieved.

Our commitment to reliable and innovative plasma systems shows in all of the projects we work on. We continue to place a strong emphasis on customer success; ensuring our clients receive the full benefits of their plasma cleaning systems through education and service.

As we look ahead to 2025, we look forward to pushing boundaries in the bonding and PCB etching markets, while enabling customers to advance their projects and initiatives.

Trade Shows

We hope to see everyone at a show this year. We'll be exhibiting at Semicon West October 7-9 in Phoenix, AZ; and CamX, April 8-11 in Orlando, FL. At each show will be demonstrating our best-selling Plasma Wand entry-level atmospheric system.

We would like to thank our customers for another great year and look forward to 2025!

Greg DeLarge, President
Plasma Etch, Inc.
http://www.plasmaetch.com
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Master-Bond

Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
Amkor-Technology