| Viewpoint |
March 5, 2024
VIEWPOINT 2024: Matthew Phillips, CEO, Ontos Equipment Systems
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Matthew Phillips, CEO, Ontos Equipment Systems
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Ontos atmospheric plasma technology has been at the cutting edge of the semiconductor packaging industry since 2011, primarily focusing on research and development but quickly moving to volume production.
The industry is now focusing on high yield, die-to-wafer hybrid bonding where absolute cleanliness is paramount. Ontos systems have the flexibility to be integrated into third party equipment and as a stand-alone system.
Custom engineering, process development, and our on going partnerships are the proven path forward for 2024 and beyond.
Matthew Phillips, CEO
Ontos Equipment Systems
http://www.ontosplasma.com
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