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February 21, 2024
VIEWPOINT 2024: Glenn Farris, Vice President, Global Customer Operations and Corporate Marketing, Universal Instruments
Advanced packaging is a critical technology to enhance semiconductor devices' performance, power efficiency, and miniaturization. This is crucial for meeting the escalating demands of A.I., HPC, Mobile Computing, Silicon Photonics, and Sensor Fusion. With its strategic focus on bolstering domestic semiconductor production, the Chips Act underscores the urgency of investing in advanced packaging technologies and equipment, enabling cutting-edge packaging architectures such as Heterogeneous Integration (H.I.). The industry can address the current semiconductor shortage and lay the foundation for a more robust and adaptable supply chain by expediting research, development, and implementation of innovative packaging solutions. Accelerating advanced packaging within the framework of the Chips Act is not merely a technological imperative; it is a strategic move that propels the semiconductor ecosystem towards higher efficiency, greater innovation, and sustainable growth in an era where semiconductors permeate every facet of modern life. As the only U.S. semiconductor equipment packaging company manufacturing high-precision and high-volume production systems, Universal is committed to investing the resources required to advance the semiconductor industry's future. Glenn Farris, Vice President, Global Customer Operations and Corporate Marketing Universal Instruments http://www.uic.com |
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