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| Viewpoint | |
January 24, 2024
VIEWPOINT 2024: Isabella Drolz, Vice President Product Marketing, Comet Yxlon
After a weak year in 2023, we expect the semiconductor industry to pick up speed again in 2024. And we are particularly looking forward to it because Comet Yxlon is ideally prepared. With our new 3D X-ray inspection solution, which we launched at productronica / SEMICON Europa in Munich in November, specifically developed for the requirements of semiconductors, we are offering completely new opportunities to this business to accelerate their ramp-up processes, optimize production, and minimize defects. For the first time, a reliable, fast, and non-destructive inspection method is available that will change the game and care for facing up to the tough competition in this fast-paced industry. From many conversations with manufacturers, we know the challenges they are confronted with. Innovation cycles are becoming constantly shorter while the complexity of integrated circuits is increasing. To remain competitive, there is a particular focus on reducing investment costs and accelerating ramp-up processes to achieve the target of a zero-defect production to introduce high-performance components faster to the market and reduce waste. The early identification of critical defects considerably accelerates the development and optimization of new production processes and thus the production start-up of new chip generations. Non-destructive, high-resolution 3D X-ray inspection is the tool for the zero-defect strategy and to save a lot of money. Key customers attest to the unbeaten image quality our solution provides. By leveraging advanced computed laminography and integrated AI technology, our CA20 solution brings high-resolution 3D X-ray capabilities to the forefront for detailed testing in the advanced packaging of integrated circuits. Three-dimensional X-ray images with a resolution of less than 1 µm can reliably identify typical defects in 3D IC solder connections, such as missing and bridged bumps, voids, non-wet, head-in-pillow, bump shift, and deviations in standoff height or deformations. Modern analysis software based on deep learning takes over the automatic evaluation, including report generation according to the user's requirements. Overall, that means a whole new level of productivity and efficiency for the semiconductor industry. We are looking forward to 2024 coming up with a huge pack of possibilities. Isabella Drolz, Vice President Product Marketing Comet Yxlon http://www.comet.tech |
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