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| Viewpoint | ||
January 19, 2023
VIEWPOINT 2023: Ken Molitor, Chief Operating Officer, QP Technologies
Business was up in all sectors, including wafer preparation, IC packaging and assembly, and our flagship products: open-molded plastic package (OmPP) air-cavity QFNs and open-cavity plastic packaging (OCPP) for package reuse. Another area of strong growth was substrate design and fabrication. We are seeing a significant rise in demand for our expertise working with advanced laminates such as FR-5, BT and ABF, as well as compound semiconductors, including silicon carbide (SiC), gallium nitride (GaN) and graphene. These materials are vital for the power and RF devices driving telecommunications, automotive, defense, and aerospace – a market we will serve more fully once our AS9100 certification is complete. We experienced very few supply-chain-related problems in 2022 and have taken measures to increase safety stock where necessary to help prevent any issues going forward. While we are cautiously optimistic that 2023 will yield similar results to what we experienced in 2022, we are watching the industry and our end markets very closely. All indications are that more and more semiconductor manufacturing capacity is freeing up, which should further help to alleviate overall chip shortages. Ken Molitor, Chief Operating Officer QP Technologies http://www.qptechnologies.com |
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