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Accurate Corner Fill Inspection SQ3000™
Nordson Test & Inspection advances industry software with AI-driven algorithms and SQ3000's MRS technology, delivering unmatched accuracy by eliminating reflections for precise, high-quality measurement applications.
Nordson Test & Inspection
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| Viewpoint |
February 18, 2020
VIEWPOINT 2020: Glenn Farris, Vice President, Marketing, Universal Instruments
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Glenn Farris, Vice President, Marketing, Universal Instruments
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What are your expectations for semiconductor packaging next year?
After a difficult year in 2019, the semiconductor and equipment industries are experiencing a strong upturn, with advanced packaging technologies a significant beneficiary of the markets strength. 5G, AI, Edge Computing, Persistent Memory, Integrated Power Management are all driving the need for innovative packaging solutions which integrate silicon produced with disparate process nodes and deliver maximum performance at optimal cost.
Heterogenous Integration, utilizing a multitude of interconnect methodologies (from Fan-out to Silicon Interposer, to Chiplet), addresses this challenge but requires unique solutions for efficient, cost effective die placement. High speed, high precision multi-die placement, directly and efficiently extracted from a range of different sized wafers, is critical to enable cost effective assembly.
Universal has been deploying solutions for efficient and cost effective multi-die placement for over a decade. Working with industry leaders, we are dedicated to further expand our innovative offerings for this market in 2020.
Glenn Farris, Vice President, Marketing
Universal Instruments
http://www.uic.com
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