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February 14, 2020

VIEWPOINT 2020: Rob Kavanagh, Global Business Director of Advanced Packaging Technologies, DuPont Electronics & Imaging
VIEWPOINT 2020: Rob Kavanagh, Global Business Director of Advanced Packaging Technologies, DuPont Electronics & Imaging
Rob Kavanagh, Global Business Director of Advanced Packaging Technologies, DuPont Electronics & Imaging
While much of the semiconductor industry experienced a downturn in 2019, largely due to corrections and price adjustments in the memory market, the advanced packaging sector remained an industry bright spot. The broadening adoption of advanced packaging across more devices helped to moderate the slowdown relative to other segments.

With the ever-expanding use of electronics in automotive, driven by advanced driver assistance systems (ADAS), along with the medical device markets and next-generation 5G devices, continued growth in system-in-package (SiP) and fan-out wafer-level packaging (FOWLP) is certain.

Moreover, companies like Intel, Samsung, TSMC and others continue to develop more complex package integration schemes as an economic and technical alternative to system-on-chip (SoC), along with recent industry-wide investment in production for fanout, SiP, and various approaches that address needs for high-speed computing and AI. With that, we don’t anticipate a slowdown in the advanced packaging sector any time soon. Rather, we anticipate a need for more advanced materials to support these innovative package architectures.

This is all good news for DuPont's Electronics & Imaging business, which just formed following completion of the DowDuPont separation in 2019. In the Advanced Packaging segment, we are leveraging our long history in the market, a broadened material portfolio and outstanding DuPont engineering capabilities to enable new technologies. Our product roadmap for 2020 reflects the benefits of this.

Targeting mmWave technology for next-generation 5G, DuPont has put in place its roadmap for low-loss materials. We unveiled a new class of low-loss dielectric materials at the 2019 IMAPS Symposium. In 2020, we will bring out early prototypes for our design partners to evaluate. Additionally, we're developing new thermal solutions for heterogeneous integration, extending on product lines originally developed by Dow Corning.

While the industry's recovery timeline remains uncertain as the trade disputes continue for now, at DuPont, we are confident that 2020 will be a year of modest growth, with advanced packaging leading the way.

Rob Kavanagh, Global Business Director of Advanced Packaging Technologies
DuPont Electronics & Imaging